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Work on ceramic, flip-chip, BGA or novel package technology you will tackle issues including die attach, die bonding, hermetic sealing, chip handling, chip to fibre alignment, epoxy curing, thermal stability, leak testing and shock+vibration. Understand package design using 3D CAD and FEA techniques. BSc+ in Physics, Mechanical or Production Engineering with experience in Optical or Semiconductor Packaging such as Power Semiconductors or III-V chip handling. More vacancies at www.remjobs.co.uk
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