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Our client is an exciting new start-up and is now searching for a Graduate Mechanical Engineer who will be working within the new module development department. The role will involve establishing available space envelopes with regards to vibration and thermal issues, modelling of thermal and stress characteristics of selected layouts, and the test and approval of prototypes and production samples.
Desired qualifications are as follows:
-Familiar with high volume semiconductor manufacturing environment
-PCB layout and design experience
-Knowledge of 3D modelling stress analysis and thermal modelling software
-Electronics packaging knowledge would be beneficial
-BSc Mechanical Engineering or equivalent
Please contact us for additional information.
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